Manufacturing method of structure

专利名称：Manufacturing method of structure发明人：大塚 学,石川 哲史,富永 康亮,佐藤 環樹申请号：JP2016106457申请日：20160527公开号：JP6700977B2公开日：20200527

摘要：PROBLEM TO BE SOLVED: To provide a method for producing a structure whichhas a photosensitive resin layer covering at least a part of a recess on a substrate havingthe recess provided thereon, and can satisfactorily pattern the photosensitive resin layereven when patterned by photolithography.SOLUTION: A method for producing a

structure includes: a step of preparing a substrate 1 having a recess 3 provided thereon; astep of sticking a film having a photosensitive resin layer 5 containing a photosensitiveresin and a support layer 9 onto the substrate and covering at least a part of the recesswith the photosensitive resin layer; a light irradiation step of irradiating the

photosensitive resin layer covering the recess through the support layer with light toform a latent image pattern on the photosensitive resin layer; a step of heating thephotosensitive resin layer at 30°C or higher and X°C or lower for 1 minute or more by aheating device when a softening point of the photosensitive resin is set at X°C (X≥30); apeeling step of peeling the support layer from the photosensitive resin layer; a step ofheating the photosensitive resin layer at X+10°C or higher by the heating device; and adevelopment step of developing the photosensitive resin layer.SELECTED DRAWING:Figure 2

申请人：キヤノン株式会社

地址：東京都大田区下丸子３丁目３０番２号

国籍：JP

代理人：阿部 琢磨,黒岩 創吾

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