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ENCAPSULATION FILM

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专利内容由知识产权出版社提供

专利名称:ENCAPSULATION FILM

发明人:YOO, Hyun Jee,KIM, Hyun Suk,MOON, Jung

Ok,YANG, Se Woo

申请号:EP16746872.7申请日:20160204公开号:EP3142164A4公开日:20180117

摘要:Provided are an encapsulation film, an organic electronic device including thesame, and a method of manufacturing the organic electronic device. Therefore, providedis the encapsulation film, which may form a structure capable of effectively blockingmoisture or water entering the organic electronic device from the outside, and haveexcellent processability in a process of manufacturing a panel and excellent heatretention under a high-temperature and high-humidity condition.

申请人:LG Chem, Ltd.

地址:128 Yeoui-daero Yeongdeungpo-gu Seoul 07336 KR

国籍:KR

代理机构:Cabinet Plasseraud

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