Multilayer ceramic substrate, electronic component

专利名称：Multilayer ceramic substrate, electronic

component, and method of manufacturingmultilayer ceramic substrate

发明人：Ikeda, Hatsuo,Ichikawa, Koji申请号：EP09157079.6申请日：20090401公开号：EP2107863A1公开日：20091007

摘要：A multilayer ceramic substrate in which an active element and a passive elementare surface-equipped over the outermost surface on one side is provided. The multilayerceramic substrate comprises a plurality of laminated ceramic substrate layers, a surfacelayer terminal electrode provided in a via hole of an outermost ceramic substrate layeron at least one side and having a surface layer via electrode and a metal plating layerdeposited over an end surface of the surface layer via electrode, and a via conductorwhich connects the surface layer terminal electrode and circuit patterns over the ceramicsubstrate layer at the inside, wherein a via hole size of a surface layer terminal electrodefor connection of the active element is smaller than a via hole size of a surface layerterminal electrode for connection of the passive element.

申请人：Hitachi Metals, Ltd.

地址：2-1, Shibaura 1-chome Minato-ku Tokyo 105-8614 JP

国籍：JP

代理机构：Huebner, Stefan Rolf

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