Low-temperature curable conductive paste for plati

专利名称：Low-temperature curable conductive paste

for plating and electric wiring using thesame

发明人：Yuichiro Akiba,Tomoko Honda,Fujio

Takahashi,Shinji Nakata

申请号：US12603718申请日：20091022公开号：US08986575B2公开日：20150324

专利附图：

摘要：A conductive paste containing a conductive powder (A), a vinyl chloride-vinyl

acetate resin (B), a polyester resin and/or polyurethane resin (C), a blocked isocyanate (D)blocked with an active methylene compound, and an organic solvent (E), wherein the resin(C) has a glass transition temperature of −50° C. to 20° C., a sum of amounts of the resin(C) is 50 to 400 parts by weight relative to 100 parts by weight of the resin (B), and a sumof amounts of the resin (B), the resin (C) component, and the blocked isocyanate (D) is 10to 60 parts by weight relative to 100 parts by weight of the conductive powder (A). Anelectric wiring in which this conductive paste is formed on an insulating substrate.

申请人：Yuichiro Akiba,Tomoko Honda,Fujio Takahashi,Shinji Nakata

地址：Ohtsu JP,Tokyo JP,Tokyo JP,Tokyo JP

国籍：JP,JP,JP,JP

代理机构：Leydig, Voit & Mayer, Ltd.

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