专利名称：LOW-TEMPERATURE CURABLE CONDUCTIVE
PASTE FOR PLATING AND ELECTRIC WIRINGUSING THE SAME
发明人：Yuichiro AKIBA,Tomoko HONDA,Fujio
TAKAHASHI,Shinji NAKATA
申请号：US12603718申请日：20091022
公开号：US20100101842A1公开日：20100429
专利附图：
摘要：A conductive paste containing a conductive powder (A), a vinyl chloride-vinyl
acetate resin (B), a polyester resin and/or polyurethane resin (C), a blocked isocyanate (D)blocked with an active methylene compound, and an organic solvent (E), wherein the resin(C) has a glass transition temperature of −50° C. to 20° C., a sum of amounts of the resin(C) is 50 to 400 parts by weight relative to 100 parts by weight of the resin (B), and a sumof amounts of the resin (B), the resin (C) component, and the blocked isocyanate (D) is 10to 60 parts by weight relative to 100 parts by weight of the conductive powder (A). Anelectric wiring in which this conductive paste is formed on an insulating substrate.
申请人：Yuichiro AKIBA,Tomoko HONDA,Fujio TAKAHASHI,Shinji NAKATA
地址：Ohtsu-shi JP,Tokyo JP,Tokyo JP,Tokyo JP
国籍：JP,JP,JP,JP
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容