Universal Serial Bus
Specification
Revision 1.01
April 4, 2007
Micro-USB Cables and Connectors
MicroUSB Specification to the USB 2.0 Specification, Revision 1.01
April 4, 2007
Revision History
Revision Issue Date 0.6 0.7 0.8
1/30/2006 3/24/2006 4/19/2006
Revisions to all sections
Added revised Micro-USB drawings to Rev.0.8
Comment
Editorial changes and additions by Jan Fahllund (Nokia)
Corrections to the 0.8 version (based by comments from contributors) 0.8b 4/26/2006 Corrections based on comments from the 0.8b version 0.9 6/7/2006 1.0RC 1.01RC 1.02RC
8/2/2006 11/10/2006 12/10/2006
Added lubricant recommendation, LLRC delta change specified Editorial changes and addition based on Oct-06 USB-IF CCWG meeting.
Shell material thickness tolerances changed so that material can be 0.25 mm or 0.3 mm; edited three pictures (Figure 4-10, 4-11 and 4-12).
Two pictures edited (Figure 4-8 and 4-9). In fig 4-8 max height to be 2.8mm MAX. In fig 4-9 R0.25mm MAX to be R0.30mm MAX. For BoD approval
1.03RC 1.0RC3
12/11/2006 12/19/2006
1.0 1/12/2007 Approved 1.0 1.01
1/22/2007 4/4/2007
Cosmetic edits for publication
Editorial corrections and additions to contributor list. Reinserted shell
and plug material requirements as section 6.10. Clarified wording on Plating Recommendations.
Copyright © 2007 USB Implementers Forum, Inc. (USB-IF).
All rights reserved.
A LICENSE IS HEREBY GRANTED TO REPRODUCE THIS SPECIFICATION FOR INTERNAL USE ONLY. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, IS GRANTED OR INTENDED HEREBY.
USB-IF AND THE AUTHORS OF THIS SPECIFICATION EXPRESSLY DISCLAIM ALL LIABILITY FOR INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS, RELATING TO IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. USB-IF AND THE AUTHORS OF THIS
SPECIFICATION ALSO DO NOT WARRANT OR REPRESENT THATSUCH IMPLEMENTATION(S) WILL NOT INFRINGE THE INTELLECTUAL PROPERTY RIGHTS OF OTHERS.
THIS SPECIFICATION IS PROVIDED \"AS IS\" AND WITH NO WARRANTIES, EXPRESS OR
IMPLIED, STATUTORY OR OTHERWISE. ALL WARRANTIES ARE EXPRESSLY DISCLAIMED. NO WARRANTY OF MERCHANTABILITY, NO WARRANTY OF NON-INFRINGEMENT, NO WARRANTY OF FITNESS FOR ANY PARTICULAR PURPOSE, AND NOWARRANTY ARISING OUT OF ANY PROPOSAL, SPECIFICATION, OR SAMPLE.
IN NO EVENT WILL USB-IF OR USB-IF MEMBERS BE LIABLE TO ANOTHER FOR THE COST OF PROCURING SUBSTITUTE GOODS OR SERVICES, LOST PROFITS, LOSS OF USE, LOSS OF DATA OR ANY INCIDENTAL, CONSEQUENTIAL, INDIRECT, ORSPECIAL DAMAGES, WHETHER UNDER CONTRACT, TORT, WARRANTY, OR OTHERWISE, ARISING IN ANY WAY OUT OF THE USE OF THIS SPECIFICATION, WHETHER OR NOT SUCHPARTY HAD ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
All product names are trademarks, registered trademarks, or service marks of their respective owners.
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MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007
Contributors
Mark Rodda, (editor) Motorola Jan Fahllund, (editor) Nokia
Jim Koser, (CCWG Chairman), Foxconn Glen Chandler, Advanced-Connectek (Acon) Charles Wang, Advanced-Connectek (Acon) Toshinori Sasaki, Across Techno Minoru Ohara, Allion Brad Brown, ATL
Christopher Mattson, ATL Marcus Darrington, ATL
Jaremy Flake, ATL Technology George Olear, Contech Research Roy Ting, Elka Sophia Liu, ETC Bill Northey, FCI
Tsuneki Watanabe, Foxconn Jim Zhao, Foxconn David Ko, Foxconn Jong Tseng, Foxconn Jack Lu, Foxlink Tim Chang, Foxlink Sathid Inthon, Fujikura Toshi Mimura, Fujijura
Alan Berkema, Hewlett-Packard Karl Kwiat, Hirose Shinya Tono, Hirose Kazu Ichikawa, Hirose Ryozo Koyama, Hirose Yousuke Takeuchi, Hirose Tsuyoshi Kitagawa, Hosiden Jim Eilers, Hosiden Kazuhiro Saito, JAE Ron Muir, JAE Mark Saubert, JAE Yasuhira Miya, JST Takahiro Diguchi, JST Yoichi Nakazawa, JST
Kevin Fang, Longwell Electronics Morgan Jair, Main Super Co.
Tom Kawaguchi, Matsushita Electric Works Ron Ward, Matsushita Electric Works
Satoshi Yamamoto, Matsushita Electric Works Yasuhiko Shinohara, Mitsumi Atsushi Nishio, Mitsumi Hitoshi Kawamura, Mitsumi Scott Sommers, Molex Kevin Delaney, Molex Kieran Wright, Molex Padraig McDaid, Molex Mikko Poikselka, Molex
Sam Liu, Newnex Technology Corp. Richard Petrie, Nokia Kai Silvennoinen, Nokia Panu Ylihaavisto, Nokia Arthur Zarnowitz, Palm Douglas Riemer, SMK Eric Yagi, SMK
Abid Hussain, Summit Microelectronics Kaz Osada, Tyco Masaru Ueno, Tyco Yoshikazu Hirata, Tyco
Ed Beeman, USB Implementers Forum Mark Paxson, USB Implementers Forum
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MicroUSB Specification to the USB 2.0 Specification, Revision 1.01
April 4, 2007
Table of Contents 1 Introduction................................................................................................................................................6 1.1 General...............................................................................................................................................6 1.2 Objective of the Specification.............................................................................................................6 1.3 Intended Audience/Scope..................................................................................................................6 1.4 Related Documents............................................................................................................................6 2 Acronyms and Terms................................................................................................................................7 3 Significant Features..................................................................................................................................8 3.1 USB 2.0 Specification Compliance....................................................................................................8 3.2 On-The-Go Device.............................................................................................................................8 3.3 Connectors.........................................................................................................................................8 3.4 Compliant Cable Assemblies.............................................................................................................8 3.5 Plug Overmolds..................................................................................................................................9 4 Cables and Connectors..........................................................................................................................10 4.1 Introduction.......................................................................................................................................10 4.2 Micro-Connector Mating...................................................................................................................10 4.3 Color Coding.....................................................................................................................................11 4.4 Device, Cable and Adapter Delays..................................................................................................11 4.5 Compliant Usage of Connectors and Cables...................................................................................12
4.5.1 Cables.................................................................................................................................12 4.5.2 Overmolds...........................................................................................................................12 4.5.3 Mechanical Interfaces.........................................................................................................12 4.5.4 Surface mount standard version drawings.........................................................................12 4.5.5 DIP-type and Midmount-type receptacles..........................................................................12 4.5.6 Connector Keying...............................................................................................................12 4.5.7 Right Angle Plugs...............................................................................................................12 4.5.8 Adapters..............................................................................................................................13 4.6 Drawings...........................................................................................................................................13 5 Electrical Compliance Requirements....................................................................................................33 5.1 Data Rates Beyond USB 2.0 (480Mb/s -->).....................................................................................33 5.2 Low Level Contact Resistance.........................................................................................................33 5.3 Contact Current Rating.....................................................................................................................33
5.3.1 Signal Contacts Only (2, 3, and 4)......................................................................................33 5.3.2 With Power Applied Contacts (1 and 5)..............................................................................33 6 Mechanical Compliance Requirements.................................................................................................34 6.1 Operating Temperature Range........................................................................................................34
6.1.1 Option I...............................................................................................................................34 6.1.2 Option II..............................................................................................................................34 6.2 Insertion Force..................................................................................................................................34 6.3 Extraction Force...............................................................................................................................34 6.4 Plating...............................................................................................................................................34
6.4.1 Option I...............................................................................................................................35 6.4.2 Option II..............................................................................................................................35 6.5 Solderability......................................................................................................................................35 6.6 Peel Strength (Reference Only).......................................................................................................35 6.7 Wrenching Strength (Reference Only).............................................................................................35 6.8 Lead Co-Planarity.............................................................................................................................35 6.9 RoHS Compliance............................................................................................................................36 6.10 Shell & Latch Materials.....................................................................................................................36
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Figures
Figure 4-1 Micro-A to Micro-B Cable..............................................................................................................14 Figure 4-2 Standard-A to Micro-B Cable.........................................................................................................15 Figure 4-3 Micro-A to Captive Cable...............................................................................................................16 Figure 4-4 Micro-A Plug Overmold, Straight...................................................................................................17 Figure 4-5 Micro-B Plug Overmold, Straight...................................................................................................18 Figure 4-6 Micro-A Plug Interface...................................................................................................................19 Figure 4-7 Micro-B Plug Interface...................................................................................................................20 Figure 4-8 Micro-A/B Plug Interface (Cut-section)..........................................................................................21 Figure 4-9 Micro-AB receptacle interface........................................................................................................22 Figure 4-10 Micro-B receptacle interface........................................................................................................23 Figure 4-11 Micro-AB Receptacle Design......................................................................................................24 Figure4-12 Micro-B Receptacle Design..........................................................................................................25 Figure 4-13 Micro-A Plug Blockage................................................................................................................26 Figure 4-14 Micro-B Plug Blockage................................................................................................................27 Figure 4-15 Micro-A Plug, Side Right Angle...................................................................................................28 Figure 4-16 Micro-A Plug, Down Right Angle.................................................................................................29 Figure 4-17 Micro-B Plug, Side Right Angle...................................................................................................30 Figure 4-18 Micro-B Plug, Down Right Angle.................................................................................................31 Figure 4-19 Adapter, Standard-A receptacle to Micro-A plug.........................................................................32
Tables
Table 4-1. Plugs Accepted By Receptacles....................................................................................................10 Table 4-2. Micro-A Plug Pin Assignments......................................................................................................10 Table 4-3. Color Coding for Plugs and Receptacles......................................................................................11 Table 4-4. Maximum Delay for Micro-Connector and Cable..........................................................................11 Table 4-5. Maximum Delay for Standard Connector Cable............................................................................11
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MicroUSB Specification to the USB 2.0 Specification, Revision 1.01
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1 Introduction
1.1 General
USB has become a popular interface for exchanging data between cell phone and portable devices. Many of these devices have become so small it is impossible to use standard USB components as defined in the USB 2.0 specification. In addition the durability requirements of the Cell Phone and Portable Devices
market exceed the specifications of the current interconnects. Since Cell Phones and other small Portable Devices are the largest market potential for USB, this specification is addressing this very large market while meeting all the requirements for electrical performance within the USB 2.0 specification.
1.2 Objective of the Specification
The purpose of this document is to define the requirements and features of a Micro-USB connector that will meet the current and future needs of the Cell Phone and Portable Devices markets, while conforming to the USB 2.0 specification for performance, physical size and shape of the Micro-USB interconnect. This is not a stand-alone document. Any aspects of USB that are not specifically changed by this specification are governed by the USB 2.0 Specification and USB On-The-Go Supplement.
1.3 Intended Audience/Scope
Cell phone and Portable Devices have become so thin that the current Mini-USB does not fit well within the
constraints of future designs. Additional requirements for a more rugged connector that will have durability past 10,000 cycles and still meet the USB 2.0 specification for mechanical and electrical performance was also a consideration. The Mini-USB could not be modified and remain backward compatible to the existing connector as defined in the USB OTG specification.
1.4 Related Documents
USB 2.0
USB OTG Supplement
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MicroUSB Specification to the USB 2.0 Specification, Revision 1.01
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2 Acronyms and Terms
This chapter lists and defines terms and abbreviations used throughout this specification. A-Device
Application B-Device
DIP-type FS
Higher than HS HS Host
HNP ID LS
Midmount-type OTG OTG device Peripheral
PCB USB USB-IF
A device with a Type-A plug inserted into its receptacle. The A-device supplies power to VBUS and is host at the start of a session. If the A-device is On-The-Go, it may relinquish the role of host to an On-The-Go B-device under certain conditions,
A generic term referring to any software that is running on a device that can control the behavior or actions of the USB port(s) on a device. A device with a Type-B plug inserted into its receptacle. The B-device is a peripheral at the start of a session. If the B-device is OTG, it may be granted the role of host from an OTG A-device.
A connector with contact and shield solder tails that are soldered through the printed circuit board Full Speed (max 12Mb/s) (480Mb/s ---> 5 Gb/s) High Speed (max 480 Mb/s)
A physical entity that is attached to a USB cable and is acting in the role of the USB host as defined in the USB Specification, Revision 2.0. This entity initiates all data transactions and provides periodic Start of Frames. Host Negotiation Protocol
Identification. Denotes the pin on the Micro connectors that is used to differentiate a Micro-A plug from a Micro-B plug. Low Speed (max 1,5 Mb/s)
A connector that is mounted in a cut-out in the printed circuit board between the top and bottom surfaces. On-The-Go
A device with the host and peripheral capabilities
A physical entity that is attached to a USB cable and is currently
operating as a “device” as defined in the USB Specification, Revision 2.0. The Peripheral responds to low level bus requests from the Host. Printed circuit board Universal Serial Bus USB Implementers Forum
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MicroUSB Specification to the USB 2.0 Specification, Revision 1.01
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3 Significant Features
This section identifies the significant features of the Micro-USB specification. The purpose of this section is
not to present all the technical details associated with each major feature, but rather to highlight its
existence. Where appropriate, this section references other parts of the document where further details can be found.
3.1 USB 2.0 Specification Compliance
Any device with Micro-USB features is first and foremost a USB peripheral that is compliant with the USB 2.0 specification.
3.2 On-The-Go Device
Any OTG Micro-USB device shall conform to the OTG requirements as set forth in the On-The-Go
Supplement to the USB 2.0 Specification.
3.3 Connectors
The USB 2.0 specification defines the following connectors:
• • •
Standard-A plug and receptacle, Standard-B plug and receptacle, and Mini-B plug and receptacle.
The Micro-USB specification defines the following additional connectors:
• Micro-B plug and receptacle • Micro-AB receptacle • Micro-A plug.
The Micro-AB receptacle is only allowed on OTG products. All other uses of the Micro-AB receptacle are prohibited. The Micro-AB receptacle accepts either a Micro-A plug or a Micro-B plug.
It is recommended that the Micro-AB continue to support HNP as requested and support full functionality as a peripheral when a Micro-B plug is inserted.
3.4 Compliant Cable Assemblies
The USB 2.0 specification defines the following cables:
• • •
Standard-A plug to Standard–B plug, Standard-A plug to Mini-B plug, and Captive cable with Standard-A plug.
The Micro-USB specification defines the following additional cables:
• • • •
Micro-A plug to Micro-B plug,
Micro-A plug to Standard-A receptacle Micro-B plug to Standard-A plug, and
Hardwired Captive cable with Micro-A plug. (Hardwired Captive cable is a cable, connected internally to a device, which is not designed to be removed by the end user of that device.)
No other types of cables are allowed by either the USB specification, or by the OTG supplement. Cables are not allowed to have receptacles on either end unless they meet the mechanical and electrical requirements of adapters defined in this document.
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3.5 Plug Overmolds
The Micro-USB specification constrains the size and the shape of the overmolds for the Micro-A and
Micro-B plugs.
The Micro-A plug’s overmold has a rectangular shape, and the Micro-B plug’s overmold is rectangular with chamfers. This allows easy recognition and differentiation of the two plugs by the consumer See pictures Figure 4-4 and Figure 4-5.
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MicroUSB Specification to the USB 2.0 Specification, Revision 1.01
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4 Cables and Connectors
4.1 Introduction
This chapter provides the mechanical and electrical specifications for the cables, connectors and cable assemblies used to interconnect devices as well as constraints on the design of the overmolds for the Micro-A and Micro-B plugs.
4.2 Micro-Connector Mating
The following table summarizes the plugs accepted by each of the receptacles.
Table 4-1. Plugs Accepted By Receptacles
Receptacle Plugs Accepted Standard-A Standard-A Standard-B Standard-B Mini-B Mini-B Micro-B Micro-B Micro-AB
The usage and wiring assignments of the five pins in the Micro-A plug are defined in the following table.
Table 4-2. Micro-A Plug Pin Assignments Contact
Number
Signal Name
Typical Wiring Assignment
Red White Micro-A or Micro-B
1 VBUS 2 D- 3 D+ Green 4 ID connected or is connected to ground by a resistance of greater than Rb_PLUG_ID (100kΩ MIN). An On-The-Go device is required to be able to detect whether a Micro-A or Micro-B plug is inserted by determining if the ID pin resistance to ground is less than Ra_PLUG_ID (10Ω MAX) or if the resistance to ground is greater than Rb_PLUG_ID . Any ID resistance less than Ra_PLUG_ID shall be treated as ID = FALSE and any resistance greater than Rb_PLUG_ID shall be treated as ID = TRUE. Black Shell Shield Drain Wire 10 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 4.3 Color Coding The following colors are mandated for the plastic inside the Micro-USB connectors defined in this specification. Table 4-3. Color Coding for Plugs and Receptacles Connector Color Micro-A plug Micro-B receptacle Micro-B plug Micro-AB receptacle White Black Black Gray 4.4 Device, Cable and Adapter Delays In Figure 7-11 of the USB 2.0 specification, four test planes are defined along the transmission path from the host transceivers to the peripheral transceivers. These test planes (TP) are as follows: • • • • TP1: pins of host transceiver chip TP2: contact points of host Standard-A receptacle TP3: contact points of peripheral Standard-B or Micro-B receptacle TP4: pins of peripheral transceiver chip The maximum total delays are as follows: • On-The-Go device - TP1 to TP2: • Adapter: • Any cable with a Micro-A or Micro-B plug: 1 ns 1 ns 10 ns The maximum delays for the two worst cases of connection are shown in the following tables. Table 4-4. Maximum Delay for Micro-Connector and Cable Location Delay Time USB 2.0 Compliant Host – TP1 to TP2 Standard-A receptacle to Micro-A plug adapter Micro-A plug to Micro-B plug cable USB 2.0 Compliant B-device – TP3-TP4 3 ns 1 ns 10 ns 1 ns Total 15 ns Table 4-5. Maximum Delay for Standard Connector Cable Location Delay Time On-The-Go Compliant Device – TP1 to TP2 Micro-A plug to Standard-A receptacle adapter Standard-A plug to Standard-B plug cable USB 2.0 Compliant B-device – TP3 to TP4 1 ns 1 ns 26 ns 1 ns Total 29 ns 11 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 4.5 Compliant Usage of Connectors and Cables Cable assemblies and connectors not described below or not allowed by other amendments to the USB specification are not compliant with the USB specification and may not be labeled as such. 4.5.1 Cables The cables allowed by the Micro-USB specification are shown in Figure 4-1, Figure 4-2, and Figure 4-3. Cables must have a propagation delay of 10 ns or less, have a physical length of no more than 2.0 meters, and meet all other requirements of a USB cable. 4.5.2 Overmolds The size and shape of the Micro-A and Micro-B plug overmolds must conform to the constraints shown in Figure 4-4 and Figure 4-5 . 4.5.3 Mechanical Interfaces The mechanical interface dimensions for the Micro-A and Micro-B plugs are shown in Figure 4-6 and Figure 4-7. Mechanical interface dimensions for Micro-AB and Micro-B receptacles are shown in Figure 4-9 and Figure 4-10. 4.5.4 Surface mount standard version drawings By following these instructions, receptacles from different manufacturers can be used interchangeably on the same printed circuit board (PCB). In the case of the “surface mount standard version”, the dimensions of the contact tail and shield tail must comply with figures 4-11 and 4-12. Note: PCB-layout drawings are included for reference only. Figure 4-11 and Figure4-12 shows designs for the Micro-AB and Micro-B receptacles respectively. 4.5.5 DIP-type and Midmount-type receptacles DIP-type (contact and shield tails soldered through PCB) and Midmount-type (connector that is mounted in a cut-out in the printed circuit board between the top and bottom surfaces.) receptacle connectors are not defined in this standards document. These mounting styles are allowed under the standard as long as all intermating conditions are met. Mechanical dimensions and mechanical durability values may vary from the Surface mount standard connector but must comply with all minimum values. 4.5.6 Connector Keying This Micro connector series has been designed so as to prevent the Micro-A and Micro-B plugs from being incorrectly inserted into a receptacle. The amount of metal blocking various possible incorrect insertions is shown in Figure 4-13 and Figure 4-14, and is always greater than 0.35 mm. 4.5.7 Right Angle Plugs The overmolds for right / down angle plugs are required to comply with the same shape constraints that apply to straight plugs. Reference drawings for right / down angle plugs are shown in Figure 4-15, Figure 4-16, Figure 4-17 and Figure 4-18 . 12 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 4.5.8 Adapters Requirements: • • • April 4, 2007 The propagation delay of the adapter shall be less than 1 ns. The physical length shall not exceed 150 mm. The resistance of the adapter through VBUS and GND, including contacts, shall not exceed 70 mΩ. 4.5.8.1 Standard-A receptacle to Micro-A plug This adapter is used to connect a cable with a Standard-A plug to an On-The-Go device that has a Micro-AB receptacle. A reference drawing for this adapter is shown in Figure 4-19. 4.6 Drawings This section contains the mechanical drawings that are referenced in the previous section. 13 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-1 Micro-A to Micro-B Cable 14 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-2 Standard-A to Micro-B Cable 15 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-3 Micro-A to Captive Cable 16 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-4 Micro-A Plug Overmold, Straight 17 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-5 Micro-B Plug Overmold, Straight 18 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-6 Micro-A Plug Interface 19 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-7 Micro-B Plug Interface 20 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-8 Micro-A/B Plug Interface (Cut-section) 21 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-9 Micro-AB receptacle interface 22 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-10 Micro-B receptacle interface 23 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-11 Micro-AB Receptacle Design 24 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure4-12 Micro-B Receptacle Design 25 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-13 Micro-A Plug Blockage 26 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-14 Micro-B Plug Blockage 27 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-15 Micro-A Plug, Side Right Angle 28 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-16 Micro-A Plug, Down Right Angle 29 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-17 Micro-B Plug, Side Right Angle 30 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-18 Micro-B Plug, Down Right Angle 31 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 Figure 4-19 Adapter, Standard-A receptacle to Micro-A plug 32 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 5 Electrical Compliance Requirements Electrical requirements are unchanged from the USB 2.0 specification (Chapter 6; Table 6-7) and the On-The-Go Supplement to the USB 2.0 Specification, unless otherwise specified here. 5.1 Data Rates Beyond USB 2.0 (480Mb/s -->) This section will be amended as requirements for higher data rates (beyond the current USB 2.0 specification) become available. 5.2 Low Level Contact Resistance 30mΩ (Max) initial when measured at 20mV (Max) open circuit at 100mA. Maximum change (delta) of +10 mΩ after 10,000 insertion/extraction cycles at a maximum rate of 500 cycles per hour. (When manually operated, mating speed should be below 200 cycles per hour.) 5.3 Contact Current Rating 5.3.1 Signal Contacts Only (2, 3, and 4) 1A minimum when measured at an ambient temperature of 25 degrees Celsius. With power applied to the contacts, the delta temperature must not exceed +30degrees Celsius at any point in the USB connector under test. 5.3.2 With Power Applied Contacts (1 and 5) 1.8A for contacts 1 and 5 and at the same time 0.5A for contacts 2, 3 & 4, minimum when measured at an ambient temperature of 25 degrees Celsius. With power applied to the contacts, the delta temperature must not exceed +30degrees Celsius at any point in the USB connector under test. 33 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 6 Mechanical Compliance Requirements The following requirements will take precedence over the requirements set forth in the USB 2.0 specification (Chapter 6; Table 6-8) and the On-The-Go Supplement to the USB 2.0 Specification. 6.1 Operating Temperature Range 6.1.1 Option I -30°C to +80°C 6.1.2 Option II -30°C to +85°C (and above) 6.2 Insertion Force Recommendations: - It is recommend to use a non-silicon based lubricant on the latching mechanism to reduce wear. If used the lubricant may not affect any other characteristic of the system. - 35 Newton’s maximum at a maximum rate of 12.5 mm(0.492\") per minute. 6.3 Extraction Force - - - 8N (MIN) after 10000 insertion/extraction cycles (at a maximum rate of 12.5mm (0.492\") per minute). No burs or sharp edges are allowed on top of locking latches (hook surfaces which will rub against receptacle shield). It is recommend to use a non-silicon based lubricant on the latching mechanism to reduce wear. If used the lubricant may not affect any other characteristic of the system. 6.4 Plating Recommendations: - - - - Contact plating should be done after stamping and forming Burrs should not be present on contact areas Contact area as smooth as possible before plating Use a sealing treatment to control plating porosity (contact area) 34 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 6.4.1 Option I 6.4.1.1 Receptacle Contact area: Contact tail: 6.4.1.2 Plug Contact area: 6.4.2 Option II 6.4.2.1 Receptacle Contact area: Contact tail: 6.4.2.2 Plug Contact area: (Min) 0.75 µm Au on top of (Min) 2.0 µm Ni (Min) 0.75 µm Au on top of (Min) 2.0 µm Ni (Min) 0.05 µm Au on top of (Min) 2.0 µm Ni April 4, 2007 (Min) 0.05 µm Au + (Min) 0.75 µm Ni-Pd on top of (Min) 2.0 µm Ni (Min) 0.05 µm Au on top of (Min) 2.0 µm Ni (Min) 0.05 µm Au + (Min) 0.75 µm Ni-Pd on top of (Min) 2.0 µm Ni 6.5 Solderability Solder shall cover a minimum of 95% of the surface being immersed, when soldered at temperature 255℃ +/-5℃ for immersion duration 5S (component is to be lead-free component) using Type R flux. 6.6 Peel Strength (Reference Only) Minimum 150N when soldered connector is pulled up from PCB in the vertical direction. 6.7 Wrenching Strength (Reference Only) Perpendicular Force Test : This test shall be performed using virgin parts. Perpendicular forces (Fp) are applied to a plug when inserted at a distance (L) of 15mm from the edge of the receptacle. Testing conditions & method should be agreed with all parties. These forces are to four direction (left, right, up, down). Compliant connectors will meet the following force thresholds with the following results : - No plug or receptacle damage: 0 - 25N - The plug can be damaged, but in such a way that the receptacle does not sustain damage: 25 - 50N 6.8 Lead Co-Planarity Co-planarity of all SMT leads shall be within 0.08mm range. 35 MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 April 4, 2007 6.9 RoHS Compliance Component is to be RoHS compliant. Lead Free plug and receptacle materials must conform to Directive 2002/95/EC of January 27, 2003 on Restriction of Hazardous Substances (RoHS). 6.10 Shell & Latch Materials Shell and latch materials for both plug and receptacle shall be stainless steel or mechanically equivalent material. 36 因篇幅问题不能全部显示，请点此查看更多更全内容