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HD74HC83RPEL资料

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HD74HC83

4-bit Binary Full Adder (with Fast Carry)

REJ03D05-0200 (Previous ADE-205-426)

Rev.2.00 Oct 06, 2005

Description

This improved full adder performs the addition of two 4-bit binary numbers. The sum (Σ) output are provided for each bit and the resultant carry (C4) is obtained from the fourth bit.

This adder features full internal look ahead across all four bit generating the carry term in ten nanoseconds typically. This provides the system designer with partial look-ahead performance at the economy and reduced package count of a ripple-carry implementation.

Features

• • • • • •

High Speed Operation: tpd (Ai or Bi to Zi) = 16 ns typ (CL = 50 pF) High Output Current: Fanout of 10 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 µA max

Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C) Ordering Information

Part Name HD74HC83FPEL HD74HC83RPEL

Package Type SOP-16 pin (JEITA) SOP-16 pin (JEDEC)

Package Code (Previous Code) PRSP0016DH-B (FP-16DAV) PRSP0016DG-A (FP-16DNV)

Package Abbreviation FP RP

Taping Abbreviation

(Quantity) EL (2,000 pcs/reel) EL (2,500 pcs/reel)

Note: Please consult the sales office for the above package availability.

Rev.2.00, Oct 06, 2005 page 1 of 6

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HD74HC83

Function Table

Outputs

Inputs

A1 / A3

B1 / B3

A1 / A3

A1 / A3

When C0 = L / When C2 = L Σ1 / Σ3 Σ2 / Σ4 C2 / C4

When C0 = H / When C2 = H

Σ1 / Σ3 Σ2 / Σ4 C2 / C4

L L L L L L L H L L H L L L H L L L H L L H L L H L L L H L H H L L L H L H H L L L H L L H L H H L H L H L H H L L L H L H H L H H L L L H H H H L L L H H L H L L L H L H L H H L H L L H H H L L L H L H L H H H L L L H H H L H L L H H L H L L H H L L H H L H H L H H H L H L H H L H H H H L H L H H H H H H L H H H H H H : L : X : Note :

High level Low level Irrelevant

Input conditions at A1, B1, A2, B2 and C0 are used to determine outputs Σ1 and Σ2 and the value of the internal carry C2.

The value at C2, A3, B3, A4 and B4 are than used to determine outputs Σ3, Σ4 and C4

Pin Arrangement

A41Σ32A33B34VCC5Σ26B27A28(Top view)Σ2B2A2B1A1Σ1A4Σ3A3B3B4Σ4C4C016B415Σ414C413C012GND11B110A19Σ1

Rev.2.00, Oct 06, 2005 page 2 of 6

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HD74HC83

Logic Diagram

C4B4A4Σ4B3A3Σ3B2A2Σ2B1A1C0Σ1

Absolute Maximum Ratings

Supply voltage range Input / Output voltage Input / Output diode current Output current VCC, GND current Power dissipation

VCC Vin, Vout IIK, IOK IO

–0.5 to 7.0 –0.5 to VCC +0.5

V V

Item Symbol Ratings Unit ±20 mA ±25 mA ICC or IGND ±50 mA PT 500 mW Storage temperature Tstg –65 to +150 °C

Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of

which may be realized at the same time.

Recommended Operating Conditions

Item Symbol Ratings Unit Conditions Supply voltage VCC 2 to 6 V Input / Output voltage Operating temperature

Input rise / fall time

*1

VIN, VOUT Ta tr, tf

0 to VCC V –40 to 85 °C 0 to 1000 0 to 500

ns

VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V

0 to 400

Note: 1. This item guarantees maximum limit when one input switches. Waveform: Refer to test circuit of switching characteristics.

Rev.2.00, Oct 06, 2005 page 3 of 6

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HD74HC83

Electrical Characteristics

Ta = 25°C

Ta = –40 to+85°C

Test Conditions

Item Symbol VCC (V) Min Typ Max Min Max Unit

Input voltage VIH 2.0 1.5 — — 1.5 — V 4.5 3.15 — — 3.15 — 6.0 4.2 — — 4.2 — VIL

2.0 — — 0.5 — 0.5 V 4.5 — — 1.35 — 1.35 6.0 — — 1.8 — 1.8 2.0 1.9 2.0 — 1.9 — V Vin = VIH or VIL IOH = –20 µA 4.5 4.4 4.5 — 4.4 — 6.0 5.9 6.0 — 5.9 — 4.5 4.18 — — 4.13 — 6.0 5.68 — — 5.63 — VOL

IOH = –4 mA IOH = –5.2 mA

Output voltage VOH

2.0 — 0.0 0.1 — 0.1 V Vin = VIH or VIL IOL = 20 µA 4.5 — 0.0 0.1 — 0.1 6.0 — 0.0 0.1 — 0.1 4.5 — — 0.26 — 0.33 IOL = 4 mA

Input current Quiescent supply

current

Iin

6.0 — — 0.26 — 0.33 IOL = 5.2 mA 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND

ICC 6.0 — — 4.0 — 40 µA Vin = VCC or GND, Iout = 0 µA

Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns)

Ta = 25°C

Ta = –40 to +85°C

Item Symbol VCC (V) Min Typ Max Min Max UnitTest Conditions

Propagation delay tPLH, tPHL 2.0 — — 150 — 190 ns C0 to Σ1 time 4.5 — 19 30 — 38 6.0 — — 26 — 33 tPLH, tPHL

2.0 — — 150 — 190 ns A1 or B1 to Σ1 4.5 — 16 30 — 38 6.0 — — 26 — 33 2.0 — — 150 — 190 ns C0 to C4 4.5 — 17 30 — 38 6.0 — — 26 — 33 tPLH, tPHL

2.0 — — 150 — 190 ns A1 or B1 to C4 4.5 — 18 30 — 38 6.0 — — 26 — 33 2.0 — — 75 — 95 ns 4.5 — 5 15 — 19 6.0 — — 13 — 16 Input capacitance

Cin

5

10

10

pF

tPLH, tPHL

Output fall time tTHL

Rev.2.00, Oct 06, 2005 page 4 of 6

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HD74HC83

Test Circuit

VCCVCCOutputA4B4A3B3A2B2A1B1C0See Function TableC4OutputΣ4OutputΣ1CL = 50 pFCL = 50 pFCL = 50 pFInputPulse generatorZout= 50ΩNote: C includes the probe and jig capacitance.L

Waveforms

trInput10 %90 %50 %90 %50 %tfVCC10 %tPHL90 %90 %VOH50 %10 %tTHLVOHVOLVOL0 VtPLHSame-phase output50 %10 %tPHL90 %tTLHtPLHInverse-phase output50 %10 %tTHL50 %10 %tTLH90 %Notes: 1. Input waveform: PRR ≤ 1 MHz, Zo = 50 Ω, tr ≤ 6 ns, tf ≤ 6 ns2. The output are measured one at a time with one transition per measurement.

Rev.2.00, Oct 06, 2005 page 5 of 6

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HD74HC83

Package Dimensions

JEITA Package CodeP-SOP16-3.95x9.9-1.27RENESAS CodePRSP0016DG-APrevious CodeFP-16DNVMASS[Typ.]0.15g*1D9F16NOTE)1. DIMENSIONS\"*1 (Nom)\"AND\"*2\"DO NOT INCLUDE MOLD FLASH.2. DIMENSION\"*3\"DOES NOTINCLUDE TRIM OFFSET.bpIndex mark*2EHEcReferenceSymbolDimension in MillimetersMinNom9.903.95Max10.30Terminal cross section ( Ni/Pd/Au plating )1Ze*3DEA28b pxML1A1Abpb1cc10.100.140.251.750.340.400.460.150.200.25θHE0°5.806.101.278°6.20AθA 1Lyexy0.250.150.6350.401Detail FZLL0.601.081.27

JEITA Package CodeP-SOP16-5.5x10.06-1.27RENESAS CodePRSP0016DH-BPrevious CodeFP-16DAVMASS[Typ.]0.24g*1D9F16NOTE)1. DIMENSIONS\"*1 (Nom)\"AND\"*2\"DO NOT INCLUDE MOLD FLASH.2. DIMENSION\"*3\"DOES NOTINCLUDE TRIM OFFSET.bpHEEIndex markReferenceSymbol*2cDimension in MillimetersMinNom10.065.50Max10.5Terminal cross section ( Ni/Pd/Au plating )1Ze*3DEA28b pxML1A1Abpb1c0.000.100.202.200.340.400.460.1510.200.25AcθHE0°7.507.801.278°8.00θA 1yLexy0.120.150.800.501Detail FZLL0.701.150.90

Rev.2.00, Oct 06, 2005 page 6 of 6

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Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.Notes regarding these materials1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.2. 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Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.Keep safety first in your circuit designs!RENESAS SALES OFFICESRefer to \"http://www.renesas.com/en/network\" for the latest and detailed information.http://www.renesas.comRenesas Technology America, Inc.450 Holger Way, San Jose, CA 95134-1368, U.S.ATel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe LimitedDukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd.10th Floor, No.99, Fushing North Road, Taipei, TaiwanTel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd.Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, ChinaTel: <86> (21) 72-1001, Fax: <86> (21) 15-2952 Renesas Technology Singapore Pte. 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