专利名称:RF MODULE发明人:Eiichi HASE申请号:US12366933申请日:20090206
公开号:US20090206959A1公开日:20090820
专利附图:
摘要:In a radio-frequency wave module including a transmission path based on adistributed parameter element, the transmission path being part of an input/outputterminal, a plurality of cavity-structured concave portions for containing semiconductor-including mounted components therein, grounding-use metallic electrodes, dielectric
substrates of at least two or more layers, and semiconductors, electrical separation isestablished between the grounding-use metallic electrodes which form the transmissionpaths based on the distributed parameter element and at least one of the grounding-usemetallic electrodes which are formed on bottom surfaces of the plurality of cavity-structured concave portions for containing the semiconductor-including mountedcomponents therein.
申请人:Eiichi HASE
地址:Iruma-shi JP
国籍:JP
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